Dang, Khanh, 		Ben Ahmed, Akram, 		Ben Abdallah, Abderazek, AND 		Tran, Xuan-Tu.
" Thermal distribution and reliability prediction for 3D Networks-on-Chip" <em>VNU Journal of Science: Computer Science and Communication Engineering</em> [Online], Volume 36 Number 1 (24 June 2020)